High Density Interconnect PCB

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High Density Interconnect PCB
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High Density Interconnect PCB

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Printed circuit boards using microvia technology, fine line width/spacing , and higher wiring density.

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  • Microvia technology (hole diameter ≤ 0.15mm)
  • Fine line width/spacing (typically ≤ 0.1mm/0.1mm)
  • Low-loss high-frequency materials
  • High Tg materials
  • Advanced manufacturing processes

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