RF PCB

1. Strict Impedance Control:
From the engineering design stage, the trace width and dielectric thickness are precisely calculated based on the selected board material, lamination structure, and copper thickness.
During manufacturing, the etching line width, dielectric layer thickness, and copper thickness are precisely controlled.
100% impedance testing is performed.

2. Fine Patterning and Etching:
Precise trace width control is maintained to ensure impedance.
Edges are required to be smooth and vertical to reduce losses and edge scattering.

3. High-Performance Surface Treatment:
Immersion gold is preferred due to its flat surface and excellent oxidation resistance.

4. Low-Loss Lamination Process:
The lamination process ensures that the dielectric layer is free of voids and bubbles and perfectly bonded to the copper foil.
For mixed material laminations (e.g., FR-4 + Rogers), special processes are required to match the thermal expansion coefficients of different materials.

5. Special Via Treatment:
Vias are points of impedance discontinuity and sources of signal leakage. Back-drilling technology is used to remove unused portions (stubs) in through-holes to reduce resonance and reflection.
For high-frequency signals, conductive paste filling or sequential lamination to form blind/buried vias may be required for optimization.

6. High-Precision Outline and Cutting:
Board edges and cutting grooves affect electromagnetic boundary conditions, which we pay special attention to.
For components such as antennas, the outline dimensions themselves are part of the circuit, requiring extremely strict tolerances.

7. Strict Cleanliness Control:
Any residual ionic contaminants can cause leakage or performance drift at high frequencies; therefore, we perform cleaning with extremely high standards.