2U Rackmount Dual 3rd Gen Intel Xeon Scalable Processor (Ice Lake-SP) and Intel® C621A/C627A PCH Network System, support DDR4 RDIMM/LRDIMM and Intel Optane up to 6TB, 8x PCIe Gen4 x8 slots for Network Expansion Module, 2x easy-swappable 2.5”SATA HDDs/SSDs, IPMI, USB 3.0, 2x 1GbE, 1x Console, CF/mSATA/miniPCI-E, M.2, Redundant PSU.
Key features
Support Dual 3rd Gen Intel® Xeon® Scalable Processors, LGA4189
Support up to 6TB DDR4 RDIMM/LRDIMM 3200MHz & Intel® Optane Persistent Memory 200 series
2x RJ45 1GbE ports, 8x PCIe Gen4 Expansion Module bays, or 2x FHFL PCIe Gen4x16 slots & 4x PCIe Gen4 Expansion Module bays
Support BMC/IPMI & hardware One-Key Bypass function
Processor System
CPU: Support single 3rd Gen Intel Xeon Scalable Processor(Ice Lake-SP), Socket P+, LGA4189
Chipset: Lewisburg C621A/C627A PCH(by SKUs)
BIOS: AMI UEFI BIOS
Memory Technology:
Total 16 DIMMs (8 channels per CPU, 1x DIMM per channel, 8 DIMMs per CPU)
–DDR4 RDIMM/LRDIMM up to 3200 MHz, up to 256GB per DIMM
–Intel® Optane™ DC Persistent Memory (DCPMM) 200 Series module, up to 512GB per DIMM
Capacity: RDIMM/ LRDIMM + DCPMM up to total 6TB
Expansion
SATA: 2x 2.5″ Hot-swap HDD/SSD
M.2: 2x M.2 2280 socket (M-Key)
Compact Flash Socket: Either for CompactFlash/mSATA/miniPCI-E (Co-Layout)
I/O
USB: 2x external USB 2.0 port
1x internal USB 3.0 pin header
Serial: 1x RJ45 Console port (COM1), 2x internal pin header (COM2 & COM3)
Power Supply Watt: 850W/1300W/1600W Redundant power supply (CRPS), 12V output / RoHS
Mechanical and Environment
Form Factor: 2U rack-mount
LED: 1x PWR LED, 1x HDD LED, 2x GPO LED
Dimension (W x D x H): 440mm(W) x 600 mm(D) x 88.9mm(H)
Operating Temperature: 0 ~ 40°C ( 32 ~104°F )
Storage Temperature: -20 ~ 75°C (-4 ~167°F)
Humidity: 5 ~ 95% relative humidity,non-operating, non-condensing
Weight: 21kg
Certification: CE/FCC
Committed to designing, producing, and integrating embedded products and cybersecurity hardware.